Recently, the highly anticipated High Performance Materials Week Tokyo kicked off. EVERSUN showcased its innovative product portfolio, covering engineering plastic additives and epoxy electronic materials, demonstrating our R&D capabilities in high-performance functional materials. The booth attracted active discussions and promising cooperation leads.

For epoxy electronic materials, we featured electronic-grade BMI resins, EMA series and phosphorus-based flame retardants. With low Dk/Df, high heat resistance, great insulation, low volatility and excellent flame retardancy, they fit precision processes for electronic packaging, CCL and new energy electronics, meeting Japan’s strict material standards.

Participation in this exhibition advances EVERSUN’s expansion into the Asia-Pacific high-end market. We will keep optimizing our material portfolio and serve global customers with reliable products and supply chains

Previous：EVERSUN Shines at Chinaplas 2026 Empowering PC Modification Upgrade with Pract
Next：最后一页