CAS:829-85-6 

 melting point 110–115 °C

1.Chiral Ligands: Synthesis of BINAP and analogues for asymmetric catalysis in high-end pharmaceuticals.

2. Optoelectronic Materials: High-performance light-emitting and charge transport materials for OLED and TADF applications.

3. High-Frequency Low-Dielectric Resins: Development of halogen-free flame-retardant resins for 5G/6G copper clad laminates (CCL).

4. Smart Supramolecules: Construction of metal-coordinated self-healing and responsive polymers.

5. Electronic Encapsulation: Surface modification of nanofillers to optimize interfacial thermal conductivity

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