It imparts materials with excellent heat resistance and high glass transition temperature (Tg). It features both gas-phase and condensed-phase flame retardant mechanisms, good low-dielectric properties (low Dk and low Df), while retaining favorable mechanical properties

Applications

5G/6G high-frequency and high-speed copper clad laminates (CCL), as well as electronic-grade thermosetting resin systems (e.g., m-PPE, hydrocarbon resins, high-frequency epoxy, etc.)

Recommended Dosage:UL94 V0 @ 1.6 mm: 18%–25%

MOQ : 1

PS：We can provide you with free samples for evaluation and test, please feel free to contact us
esc086@espoly.com