Viscosity: 40000 cP

Dk: 2.3; Df: 0.00176 @ 20 GHz

Td > 400 °C

Weight loss < 1.5% at 300 °C (TGA)

Applications: Electronic encapsulation, high-frequency high-speed CCL, high-temperature adhesives and adhesive films; compatible with both UV-curing and thermal curing

1. Electronic Encapsulation and Chip-Level Adhesives: Used for semiconductor die attach adhesives and underfill materials. It features low moisture absorption, high heat resistance and strong adhesion to ensure reliability under extreme conditions.

2. High-Frequency High-Speed CCL and PCB: With ultra-low Dk/Df values and excellent thermal resistance, it serves as a core component for 5G/6G high-frequency high-speed substrates and resin modification.

3. High-Temperature Structural Adhesives and Adhesive Films: Applied in aerospace and high-end electronics to fabricate structural adhesive films with high strength, moisture-heat resistance and good peel strength.

4. Advanced Composites and Special Coatings: Suitable for high-performance resin matrices and dual-cure systems, overcoming the drawbacks of brittleness and narrow processing window of conventional high-temperature resistant resins

MOQ : 1

PS：We can provide you with free samples for evaluation and test, please feel free to contact us
esc086@espoly.com