melting point 160–170 °C

1. Reactive Halogen-Free Flame Retardants: Polyester or nylon backbones are incorporated to achieve long-term anti-migration performance.

2. 5G/6G Electronic Resins: For copper clad laminates, balancing high heat resistance and low dielectric properties.

3. Optoelectronic and Encapsulation Materials: Used as OLED intermediates or nanofiller modifiers.

4. Metal Ion Chelation: Applied for efficient heavy metal capture and extraction

MOQ : 1

PS：We can provide you with free samples for evaluation and test, please feel free to contact us
esc086@espoly.com